ニュース
TI’s ultra-low power Sub-1 GHz LaunchPad™ development kit is first to be Sigfox verified in Japan
Over the past year, Sigfox, the world’s leading provider of a global communication solution powering the Internet of Things (IoT), and Texas Instruments (TI) (NASDAQ: TXN) have been working to increase IoT deployments using the Sub-1 GHz spectrum. Continuing on that journey, today TI announced that its ultra-low power SimpleLink™ Sub-1 GHz CC1310 wireless microcontroller (MCU) LaunchPad™ development kit is now Sigfox verified in Japan. For more information about TI and Sigfox, visit www.ti.com/sub1ghz.
By using the Sigfox network being deployed and operated in Japan by KYOCERA Communication Systems (KCCS), developers creating wireless sensor IoT devices can take advantage of the ultra-low power nature and advanced integration of the CC1310 wireless MCU as it includes an ultra-low power radio, integrated ARM® Cortex®-M3 MCU, sensor controller and low-power modes in a small 4x4 mm QFN package. By using the Sigfox device-to-cloud communication solution, developers can reduce the cost and effort to get sensor data to the cloud and TI’s Sub-1 GHz technology provides years of battery life for less maintenance and long range.
“We are delighted to work with TI to enable high-value, low-cost objects to come alive on the Sigfox network in Japan and across the globe.” said Roswell Wolff, President of Sigfox Asia Pacific. “That network, announced on November 9 with our partner KCCS, will introduce solutions to Japan – one of the leading markets for Internet of Things. We already see indicators supporting the exponential growth of demand to connect millions of devices over a simple, low-cost, low-power and long-range network in our IoT ecosystem. TI’s commitment to developing key components for IoT will ensure that companies can realize the power and value of connected devices.”
“We welcome TI’s deployment of Sigfox ultra-low power Sub-1 GHz wireless MCUs in the Japanese market. As the Sigfox operator in Japan, we will actively deploy the Sigfox network in Japan,” said Yoshihito Kurose, President, KYOCERA Communication Systems Co., Ltd. “Having TI’s device with a proven track record in the global market is very encouraging, and we see TI as a strong collaborator to develop the IoT market in Japan”
As the first verified Sigfox system-on-chip (SoC) design in Japan, TI’s SimpleLink CC13xx wireless MCU platform brings a new level of scalability to the market by offering a range of Flash sizes from 32 kB up to 128 kB. The CC1310 design solution paired with the Sigfox IoT network is addressing a wide-range of IoT applications including building and home automation, factory automation, smart meters, agriculture and livestock sensors, asset tracking and smart cities.
“We are excited to expand our support for Sigfox’s network with the CC1310 wireless MCU design certification in Japan,” said Kim Wong, vice president, Wireless Connectivity Solutions, TI. “With the level of integration and low power features which the CC1310 wireless MCU offers, we believe this will open the door to enable a number of IoT solutions.”
By using the Sigfox network being deployed and operated in Japan by KYOCERA Communication Systems (KCCS), developers creating wireless sensor IoT devices can take advantage of the ultra-low power nature and advanced integration of the CC1310 wireless MCU as it includes an ultra-low power radio, integrated ARM® Cortex®-M3 MCU, sensor controller and low-power modes in a small 4x4 mm QFN package. By using the Sigfox device-to-cloud communication solution, developers can reduce the cost and effort to get sensor data to the cloud and TI’s Sub-1 GHz technology provides years of battery life for less maintenance and long range.
“We are delighted to work with TI to enable high-value, low-cost objects to come alive on the Sigfox network in Japan and across the globe.” said Roswell Wolff, President of Sigfox Asia Pacific. “That network, announced on November 9 with our partner KCCS, will introduce solutions to Japan – one of the leading markets for Internet of Things. We already see indicators supporting the exponential growth of demand to connect millions of devices over a simple, low-cost, low-power and long-range network in our IoT ecosystem. TI’s commitment to developing key components for IoT will ensure that companies can realize the power and value of connected devices.”
“We welcome TI’s deployment of Sigfox ultra-low power Sub-1 GHz wireless MCUs in the Japanese market. As the Sigfox operator in Japan, we will actively deploy the Sigfox network in Japan,” said Yoshihito Kurose, President, KYOCERA Communication Systems Co., Ltd. “Having TI’s device with a proven track record in the global market is very encouraging, and we see TI as a strong collaborator to develop the IoT market in Japan”
As the first verified Sigfox system-on-chip (SoC) design in Japan, TI’s SimpleLink CC13xx wireless MCU platform brings a new level of scalability to the market by offering a range of Flash sizes from 32 kB up to 128 kB. The CC1310 design solution paired with the Sigfox IoT network is addressing a wide-range of IoT applications including building and home automation, factory automation, smart meters, agriculture and livestock sensors, asset tracking and smart cities.
“We are excited to expand our support for Sigfox’s network with the CC1310 wireless MCU design certification in Japan,” said Kim Wong, vice president, Wireless Connectivity Solutions, TI. “With the level of integration and low power features which the CC1310 wireless MCU offers, we believe this will open the door to enable a number of IoT solutions.”