購入 L9700とBYCHPS
保証付きで購入する
簡潔な
BYCHIPSは、 L9700、我々はすぐに出荷するための株式を持っており、また、長い時間の供給が可能です。あなたの購入計画をお送りください L9700をメールでお送りします。
規格
| 電圧 - クランピング: | - |
|---|---|
| 技術: | Mixed Technology |
| サプライヤデバイスパッケージ: | 8-Mini DIP |
| シリーズ: | - |
| パッケージング: | Tube |
| パッケージ/ケース: | 8-DIP (0.300", 7.62mm) |
| 回路の数: | 6 |
| 装着タイプ: | Through Hole |
| 水分感受性レベル（MSL）: | 3 (168 Hours) |
| 製造元の部品番号: | L9700 |
| 説明: | IC LIMITER HEX PREC 8-MINIDIP |
| アプリケーション: | General Purpose |
| Email: | [email protected] |
同様のモデルのL9700
最新ニュース
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers